裝置與材料端亦有重要進展。德國 Bosch 宣佈成立專屬半導體部門，強化晶片事業佈局。材料供應商 Entegris 進軍碳化矽與鑽石散熱材料市場，鎖定 AI 先進封裝的散熱需求。裝置商 ACM Research 則出貨首臺 310 × 310 毫米麵板級水平電鍍生產裝置，推進面板級封裝製程。
地緣政治風險升溫。據報導，Nvidia 已指示資料中心客戶降低對中國市場的曝險，反映美方出口管制持續收緊。中國方面，高層提出「四大挑戰」新論述，市場對救市措施反應平淡，投資人對中國 AI 與半導體前景仍持觀望態度。美國期中選舉逼近，科技與 AI 類股買盤回籠，Nvidia、AMD 等領漲，惟 Apple 表現相對疲弱。
消息來源
◆
Before You Buy IREN Stock, Consider This Funding Gap
EN
◆
Stock Market Today, Nov. 3: Marvell Shares Edge Higher After Premarket Drop on $115 Billion Lumentum Deal
EN
◆
Investors unimpressed by latest rescue efforts; Wang Huning on the “Four Major Challenges 四大挑战”; Li Qiang on AI; Nvidia and China
EN
◆
Vorsicht vor den US-Wahlen: Tech-Aktien drehen auf - Apple agiert als Bremsklotz
DE
◆
FT: Nvidia orienta clientes de centros de dados a reduzir exposição à China
PT
◆
Nvidia is happy to take your money whether you're using open or closed models, says Jensen Huang
EN
◆
États-Unis: quelle sera la marge de manoeuvre des Démocrates en cas de victoire aux Midterms ?
FR
◆
AMD forecasts quarterly revenue above estimates as data centre growth accelerates
EN
◆
What’s in the November/December 2026 Issue?
EN
◆
Anthropic’s IPO is a high-stakes referendum on Big Tech — and this chart proves it
EN
◆
Midterms : Vague bleue sur le Congrès ?
FR
◆
Bosch Establishes Dedicated Semiconductor Division to Strengthen Chip Business
EN
◆
L'Instant poésie de Rebeka Warrior : Les haïkus de Santōka Taneda, vivre l'instant présent
FR
◆
Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging
EN
◆
ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool